THERMAL ISOLATION MICROSTRUCTURE
Assignee
HONEYWELL INC., A CORP. OF DE
Filed
Feb 29, 1988
Granted
Jul 9, 1996
Location
MINNETONKA MN US
Abstract
A thermal isolation microstructure fabricated by a process which allows the ultra thinning of support legs for the microdetector.
Source: Google Patents
35 USC §181 Secrecy Order
Imposed
Nov 3, 1988
Rescinded
May 28, 1992
Duration
3 years, 6 months
Inventor
- 1G. BENJAMIN HOCKER
Record Details
- Patent number
- US 5534111
- Application
- 07172118
- Aerospace match
- No
- Dataset source
- 35 USC §181 SO records
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