THREE DIMENSIONAL PRINTED CIRCUITS
Assignee
MOTOROLA, INC.
Filed
Jun 16, 1986
Granted
Aug 16, 1994
Location
SCOTTSDALE AZ US
Abstract
Printed circuits which reside on three dimensional surfaces are disclosed. Using a first technique, a three dimensional surface is formed on a substrate having a high melting point or permitting a high degree of infrared energy transmittance. The surface contains a layer of metalization maintained at a depth of less than two microns. An infrared laser then moves around the surface and selectively vaporizes metalization leaving a desired printed circuit pattern. The remaining metalization is plated to a useable depth. Using a second technique, a fiber optic bundle is machined on one end to mate with the three dimensional surface. The three dimensional surface, metalized and coated with photo resist, resides in intimate contact with this first end. A second end of the cable is flat and resides in intimate contact with two dimensional master photo artwork. A pattern is exposed on the photoresist through the fiber optic bundle, and the metalization is etched using conventional techniques.
Source: Google Patents
35 USC §181 Secrecy Order
Imposed
Aug 21, 1987
Rescinded
Apr 15, 1994
Duration
6 years, 7 months
Inventor
- 1JAMES M. HENDERSON
Record Details
- Patent number
- US 5338645
- Application
- 06874733
- Aerospace match
- Yes
- Dataset source
- 35 USC §181 SO records
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