US 5693741Tier 1 — UAP Program Assignee
LIQUID MOLDING COMPOUNDS
Assignee
Boeing
Filed as: BOEING COMPANY, THE, A CORP. OF DE
Filed
Mar 15, 1988
Granted
Dec 2, 1997
Location
BELLEVUE WA US
Abstract
Low molecular weight resins that usually are aliphatic and that include crosslinking thermal functional groups are useful as liquid molding compounds for reaction injection molding or resin transfer molding. The compounds eliminate the need to handle solvents when preparing thermoset composites.
Source: Google Patents
35 USC §181 Secrecy Order
Imposed
Apr 5, 1989
Rescinded
Nov 9, 1993
Duration
4 years, 7 months
Inventor
- 1CLYDE H. SHEPPARD
Record Details
- Patent number
- US 5693741
- Application
- 07168289
- Aerospace match
- No
- Dataset source
- 35 USC §181 SO records
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BoeingBack to patent indexSource: USPTO 35 USC §181 secrecy order records