Research/Patents/US 5596050
US 5596050

HIGH MODULUS EPOXY RESIN SYSTEMS

Assignee

UNION CARBIDE CORPORATION A CORP. OF NY

Filed

Mar 1, 1984

Granted

Jan 21, 1997

Location

SOMERVILLE NJ US

Abstract

Described herein are resinous compositions comprising a particular cycloaliphatic epoxy resin and the adduct of these epoxy resins with an aromatic active hydrogen-containing compound. These compositions afford unreinforced castings with higher heat deflection temperatures, faster cure rates, and reduced water uptake than similar compositions containing epoxy adducts made from aliphatic polyols.

Source: Google Patents

35 USC §181 Secrecy Order

Imposed

Jul 27, 1984

Rescinded

Nov 5, 1993

Duration

9 years, 3 months

Inventor

  • 1HUGH C. GARDNER
Back to patent indexSource: USPTO 35 USC §181 secrecy order records