A METHOD FOR PACKAGING A SURFACE ACOUSTIC WAVE DEVICE

Assignee

RAYTHEON COMPANY A CORP. OF DE

Filed

Sep 13, 1984

Granted

Jan 21, 1997

Location

Cambridge MA (Draper Lab/MIT)

Abstract

A pair of crystallographically matched piezoelectric substrates are sealed together to provide a package for a SAW device. A sealant material including a glass frit is deposited on a selected portion of a first one of the pair of substrates. The substrate having the sealant material is then heated to a temperature which is substantially below the glazing temperature of the sealant material to dry the sealant material. The substrate having the dried sealant material is heated a second time at a temperature just above the softening temperature of the glass frit to glaze the glass frit component with other components of the sealant material being driven from the glass frit during the heating cycles. The substrate having the glazed frit and the other remaining substrate are then mated together in a predetermined manner. While the substrates are held together by exerting a downward pressure on the two mated substrates, the mated substrates are heated in a vacuum to a temperature substantially above the softening temperature of the sealant material, but below the crystallographic transformation temperature of the material of the substrates. This last heating cycle is used to seal the mated pair of substrates and to provide the packaged SAW device.

Source: Google Patents