LOW THERMAL STRESS IMPINGEMENT COOLING APPARATUS
Assignee
UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE UNITED STATES AIR FORCE, THE
Filed
Jun 6, 1986
Granted
Sep 24, 1996
Location
CINCINNATI OH US
Abstract
An impingement cooling arrangement which avoids thermal cycling fatigue failures in the cooled member and cooling baffle member while retaining permanent rigid attachment of the cooling baffle member and cooled members at their periphery. The baffle includes an array of stress relieving smoothly curved in cross section furrows or grooves dispersed over the baffle surface and provides for intentional heat conduction to the furrow valley portions as a stress relieving mechanism. Heat conduction to the furrow valley portions is aided by the force of pressurized impingement cooling air at the baffle surface.
Source: Google Patents
35 USC §181 Secrecy Order
Imposed
Aug 8, 1986
Rescinded
Nov 7, 1995
Duration
9 years, 3 months
Inventor
- 1DUDLEY O. NASH
Record Details
- Patent number
- US 5557932
- Application
- 06874207
- Aerospace match
- No
- Dataset source
- 35 USC §181 SO records