ELECTRICAL FEEDTHROUGH STRUCTURE AND FABRICATION METHOD
Assignee
SPECTROLAB, INC. A CA CORPORATION
Filed
Aug 19, 1991
Granted
Jun 20, 1995
Location
N. HOLLYWOOD CA US
Abstract
In an electrical via structure and fabrication method that is particularly suited to coplanar contact solar cells, an initial opening (38,48a,48b,64) through the substrate is coated and substantially closed with a dielectric material (42,52,80). An inner opening (44) is then formed through the dielectric, and the via is provided with a conductive coating (46,54). The dielectric is initially applied in a liquid state and is thereafter cured to a solid. The need for strong chemical etchants to smooth the via opening prior to application of the dielectric and metallization is eliminated, and a polyimide dielectric on a GaAs/Ge solar cell has resulted in a substantial improvement in leakage resistance and cell efficiency.
Source: Google Patents
35 USC §181 Secrecy Order
Imposed
Oct 23, 1992
Rescinded
Jul 29, 1994
Duration
1 year, 9 months
Inventor
- 1BRUCE T. CAVICCHI
Record Details
- Patent number
- US 5425816
- Application
- 07751364
- Aerospace match
- No
- Dataset source
- 35 USC §181 SO records