Research/Patents/US 5397962
US 5397962

SOURCE AND METHOD FOR GENERATING HIGH-DENSITY PLASMA WITH INDUCTIVE POWER COUPLING

Assignee

TEXAS INSTRUMENTS INCORPORATED, A CORP. OF DE

Filed

Jun 29, 1992

Granted

Mar 14, 1995

Location

DALLAS TX US

Abstract

A source and method for generating high density plasma with inductive radio-frequency power coupling is provided in which coil antenna sections (34) within a plasma source (12) are used to generate a high-density uniform plasma. This plasma is then guided into transferred in a transfer chamber (14) and then to a processing chamber (16). Within the processing chamber (16), the plasma reacts with a semiconductor wafer (18) or another workpiece for plasma-enhanced deposition or etch processing.

Source: Google Patents

35 USC §181 Secrecy Order

Imposed

Jun 16, 1993

Rescinded

Jun 29, 1993

Duration

13 days

Inventor

  • 1MEHRDAD M. MOSLEHI

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Back to patent indexSource: USPTO 35 USC §181 secrecy order records