HDI IMPEDANCE MATCHED MICROWAVE CIRCUIT ASSEMBLY
Assignee
Martin Marietta
Filed as: MARTIN MARIETTA CORPORATION
Filed
Apr 14, 1992
Granted
Oct 11, 1994
Location
Bethesda MD (defense contractors)
Abstract
Active components of a microwave system are interconnected on a substrate by a dielectric-overlay, high-density-interconnect structure in a manner which provides close impedance matching, minimizes impedance discontinuities and substantially increases the yield of good circuits.
Source: Google Patents
35 USC §181 Secrecy Order
Imposed
Dec 17, 1992
Rescinded
Mar 7, 1994
Duration
1 year, 2 months
Inventor
- 1WILLIAM P. KORNRUMPF
Sensitive facility: Bethesda MD (defense contractors)
Record Details
- Patent number
- US 5355102
- Application
- 00786909
- Aerospace match
- No
- Dataset source
- 35 USC §181 SO records
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