US 5345205
COMPACT HIGH DENSITY INTERCONNECTED MICROWAVE SYSTEM
Assignee
GENERAL ELECTRIC COMPANY,
Filed
Apr 5, 1990
Granted
Sep 6, 1994
Location
ALBANY NY US
Abstract
A multimodule microwave system is assembled in a physically compact, high reliability manner employing a high density interconnect structure to interconnect the different modules of a microwave system by rendering the portion of the interconnect structure between modules flexible and by folding the interconnect structure on appropriate sized mandrels between the modules to place the modules in a multi-tier physical stack. Shielding and hermetic packaging may also be provided.
Source: Google Patents
35 USC §181 Secrecy Order
Imposed
Feb 26, 1991
Rescinded
Mar 7, 1994
Duration
3 years
Inventor
- 1WILLIAM P. KORNRUMPF
Record Details
- Patent number
- US 5345205
- Application
- 07504753
- Aerospace match
- No
- Dataset source
- 35 USC §181 SO records
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GENERAL ELECTRIC COMPANY,Back to patent indexSource: USPTO 35 USC §181 secrecy order records