HIGH DENSITY INTERCONNECT STRUCTURE INCLUDING A SPACER STRUCTURE AND A GAP

Abstract

A high frequency electronic component which is interconnected with other components through a high density interconnect structure sees only an air dielectric constant in the high density interconnect structure because a spacer structure disposed on the electronic component spaces the dielectric of the high density interconnect structure from the surface of the electronic component by a sufficient distance that the higher dielectric constant of the polymer dielectric layers of the high density interconnect structure only minimally affects the operating characteristics of the electronic components.

Source: Google Patents

35 USC §181 Secrecy Order

Inventor

• 1HERBERT S. COLE