LOW TEMPERATURE PROCESS FOR THE FORMATION OF CERAMIC COATINGS
Assignee
DOW CORNING CORPORATION, A CORP. OF MI
Filed
Feb 21, 1989
Granted
Aug 9, 1994
Location
MIDLAND MI US
Abstract
A single or multilayer ceramic or ceramic-like coating process is provided which can be applied to heat sensitive substrates such as electronic devices. The process includes the steps of coating the substrate with a solution comprising a hydrogen silsesquioxane resin diluted in a solvent and then evaporating the solvent, thereby depositing a preceramic coating on the substrate. The preceramic coating is then ceramified to a silicon dioxide-containing ceramic by heating the preceramic coating to a temperature of between about 40 DEG to about 400 DEG C. in the presence of ozone which enhances the rate at which the ceramification proceeds and permits the ceramification of the coating to proceed at low temperatures. Additional layers of ceramic materials may be deposited over the initial layer and act as passivating and/or barrier protective layers.
Source: Google Patents
35 USC §181 Secrecy Order
Imposed
Jul 19, 1989
Rescinded
Jul 16, 1993
Duration
3 years, 12 months
Inventor
- 1LOREN A. HALUSKA
Record Details
- Patent number
- US 5336532
- Application
- 07312457
- Aerospace match
- No
- Dataset source
- 35 USC §181 SO records