Research/Patents/US 5306448
US 5306448

METHOD FOR RESIN TRANSFER MOLDING

Assignee

UNITED TECHNOLOGIES CORPORATION

Filed

Dec 28, 1987

Granted

Apr 26, 1994

Location

CAMPBELL CA US

Abstract

A resin reservoir particularly adapted for use with a resin transfer molding process. This reservoir comprises a pressure yielding porous sponge containing about two to about ten times the sponge's weight in resin. The reservoir is used in a resin transfer molding process. The process comprises applying pressure to a pressure yielding porous sponge containing resin to transfer the resin to a porous article precursor. The resin reservoir facilitates resin transfer molding by providing a resin reservoir that can ensure the desired impregnation of a porous preform such as a dry fiber composite precursor.

Source: Google Patents

35 USC §181 Secrecy Order

Imposed

Oct 5, 1990

Rescinded

Jul 13, 1993

Duration

2 years, 9 months

Inventor

  • 1ROBERT V. KROMREY
Back to patent indexSource: USPTO 35 USC §181 secrecy order records