BUILDING BLOCK APPROACH TO MICROWAVE MODULES
Assignee
General Electric
Filed as: GENERAL ELECTRIC COMPANY, A NY CORP.
Filed
Apr 5, 1990
Granted
Apr 27, 1993
Location
ALBANY NY US
Abstract
Microwave components are prepackaged and pretested to provide standard microwave components or subsystems. A dielectric overlay interconnection structure enables accurate testing and rework of out of specification packages. Microwave systems are formed of a plurality of such prepackaged components with a high yield.
Source: Google Patents
35 USC §181 Secrecy Order
Imposed
Sep 18, 1990
Rescinded
Jul 29, 1992
Duration
1 year, 10 months
Inventor
- 1WILLIAM P. KORNRUMPF
Record Details
- Patent number
- US 5206712
- Application
- 00750476
- Aerospace match
- No
- Dataset source
- 35 USC §181 SO records
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