COPPER VAPOR LASER MODULAR PACKAGING ASSEMBLY
Assignee
US Government
Filed as: UNITED STATES ENRICHMENT CORPORATION
Filed
Jan 18, 1989
Granted
Dec 1, 1992
Location
Bethesda MD (defense contractors)
Abstract
A modularized packaging arrangement for one or more copper vapor lasers and associated equipment is disclosed herein. This arrangement includes a single housing which contains the laser or lasers and all their associated equipment except power, water and neon, and means for bringing power, water, and neon which are necessary to the operation of the lasers into the container for use by the laser or lasers and their associated equipment.
Source: Google Patents
35 USC §181 Secrecy Order
Imposed
May 17, 1989
Rescinded
Mar 12, 1992
Duration
2 years, 10 months
Inventor
- 1TERRY W. ALGER
Sensitive facility: Bethesda MD (defense contractors)
Record Details
- Patent number
- US 5168393
- Application
- 00729881
- Aerospace match
- Yes
- Dataset source
- 35 USC §181 SO records
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