Research/Patents/US 5168393
US 5168393Tier 3 — General Defense

COPPER VAPOR LASER MODULAR PACKAGING ASSEMBLY

Assignee

US Government

Filed as: UNITED STATES ENRICHMENT CORPORATION

Filed

Jan 18, 1989

Granted

Dec 1, 1992

Location

Bethesda MD (defense contractors)

Abstract

A modularized packaging arrangement for one or more copper vapor lasers and associated equipment is disclosed herein. This arrangement includes a single housing which contains the laser or lasers and all their associated equipment except power, water and neon, and means for bringing power, water, and neon which are necessary to the operation of the lasers into the container for use by the laser or lasers and their associated equipment.

Source: Google Patents

35 USC §181 Secrecy Order

Imposed

May 17, 1989

Rescinded

Mar 12, 1992

Duration

2 years, 10 months

Inventor

  • 1TERRY W. ALGER

Sensitive facility: Bethesda MD (defense contractors)

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Back to patent indexSource: USPTO 35 USC §181 secrecy order records