PHOTOSENSITIVE POLYIMIDE COMPOSITIONS
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION, A CORP. OF NY
Filed
Dec 28, 1989
Granted
May 19, 1992
Location
WAPPINGERS FALL NY US
Abstract
New photosensitive polyimide compositions and processes of using the same in the fabrication of electronic components are provided. These compositions are comprised of ##STR1## containing polyamic acids and/or the corresponding hydroxy-polyamic esters, or hydroxypolyimides and a photoactive component as an additive or as covalently bonded functionality on the polymer chain. These compositions provide positive or negative patterning options and may be used as conventional resist materials, as imageable dielectric or passivating layers, as high Tg ion implant masks or as imageable lift-off layers in the fabrication of multilevel metal structures.
Source: Google Patents
35 USC §181 Secrecy Order
Imposed
Apr 20, 1990
Rescinded
May 18, 1991
Duration
1 year
Inventor
- 1RANEE WAI-LING KWONG
Record Details
- Patent number
- US 5114826
- Application
- 00745813
- Aerospace match
- Yes
- Dataset source
- 35 USC §181 SO records
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