VIA FORMATION METHOD FOR MULTILAYER INTERCONNECT BOARD
Assignee
MICROLITHICS CORPORATION, A CORP. OF CO
Filed
Sep 15, 1989
Granted
Apr 28, 1992
Location
ARVADA CO US
Abstract
A method of boring holes in a circuit board assembly of the type having a first layer of material which is primarily reflective of light of a first light wavelength and having a second layer of material, overlying the first layer of material, which is primarily absorptive of light of the first light wavelength, comprising: tuning the frequency of a laser cutting device to the first light wavelength; directing a laser beam from the tuned laser cutting device onto the second layer of material in a region where a hole is to be provided; and terminating application of the laser beam after a hole has been bored through the second layer of material.
Source: Google Patents
35 USC §181 Secrecy Order
Imposed
Apr 18, 1990
Rescinded
Aug 30, 1990
Duration
4 months
Inventor
- 1THOMAS S. LINCOLN
Record Details
- Patent number
- US 5108785
- Application
- 00740812
- Aerospace match
- Yes
- Dataset source
- 35 USC §181 SO records
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