GLASSY BINDER SYSTEM FOR CERAMIC SUBSTRATES, THICK FILMS AND THE LIKE
Assignee
NAVY, THE UNITED STATES OF AMERICA AS REPRESENTED BY THE DEPARTMENT OF
Filed
Mar 25, 1988
Granted
Aug 27, 1991
Location
Arlington VA (defense contractors)
Abstract
A ceramic material for electronic circuit devices is sintered at less than or equal to 1000 DEG C. temperature. A filler material such as quartz and a glassy binder RO-Al2O3-B2O3 are mixed together along with an appropriate glassy binder prior to firing. RO is drawn from the group of metal oxides MgO, CaO, SrO, BaO, ZnO or CdO and the glassy binders form no more than 40 vol% of the ceramic material. The glassy binder has a suitable viscosity and other properties so that after it is mixed with the quartz filler, sintering occurs at the relatively low temperature. As a consequence, high conductivity conductors made of copper, silver and gold can be appropriately metallized prior to firing. The strength and low dielectric constant of the ceramic material make the material well adapted for ceramic substrates, thick films and the like which are used in VHSIC and VLSI applications.
Source: Google Patents
35 USC §181 Secrecy Order
Imposed
Feb 1, 1989
Rescinded
Mar 5, 1991
Duration
2 years, 1 month
Inventor
- 1DOUGLAS M. MATTOX
Sensitive facility: Arlington VA (defense contractors)
Record Details
- Patent number
- US 5043302
- Application
- 07172838
- Aerospace match
- No
- Dataset source
- 35 USC §181 SO records