EMI SHIELDING COMPOSITES
Assignee
DOW CHEMICAL COMPANY, THE
Filed
Jun 11, 1984
Granted
Nov 27, 1990
Location
MIDLAND MI US
Abstract
A resinous composite material is disclosed containing randomly dispersed fibers and from about 0.05 to 30 percent of a particulate conductive or semi-conductive filler. In addition to providing excellent EMI shielding properties, these composites are formable and are of sufficient strength to act as structural components.
Source: Google Patents
35 USC §181 Secrecy Order
Imposed
Feb 8, 1985
Rescinded
May 23, 1986
Duration
1 year, 3 months
Inventor
- 1JEFFREY GAMBLE
Record Details
- Patent number
- US 4973514
- Application
- 06619437
- Aerospace match
- No
- Dataset source
- 35 USC §181 SO records
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