SELF-ALIGNING BONDING TECHNIQUE
Assignee
RAYTHEON COMPANY, A CORP OF DE
Filed
Apr 8, 1985
Granted
Jan 17, 1989
Location
DANVERS MA US
Abstract
A method of providing uniform application of pressure during thermocompression bonding of semiconductor elements onto a bonding surface of a semiconductor package is described. A member having a plane surface is interposed between the semiconductor element and the bonding tool to provide a uniform force distribution to the plane surface of the member and hence to the semiconductor elements. In a preferred embodiment, a plano-convex vitreous member is placed upon the top of the semiconductor element with the plane surface thereof contacting the semiconductor element. A bonding tool is brought into contact with the convex surface portion of the hemisphere transmitting a uniform force to the plane surface, Thus, uniform force is brought to bear upon the semiconductor element providing a uniform thermocompression bond between the semiconductor element and the bonding surface. The plano-convex members are provided by placing members having at least one curved surface, for example, spheres in an abradible securing medium and abrading an exposed area of said spheres and the medium until a predetermined plane surface is provided. The resulting plano-convex members are then freed from the medium and recovered.
Source: Google Patents
35 USC §181 Secrecy Order
Imposed
Jul 21, 1986
Rescinded
Jul 23, 1987
Duration
1 year
Inventor
- 1DINO E. ARGENTINI
Record Details
- Patent number
- US 4798643
- Application
- 06721243
- Aerospace match
- No
- Dataset source
- 35 USC §181 SO records